BERGQUIST® GAP PAD® TGP A2000
Známé jako Gap Pad® A2000
Vlastnosti a výhody
BERGQUIST GAP PAD TGP A2000, High Performance, Thermally Conductive Gap Filling Material
BERGQUIST® GAP PAD TGP A2000 acts as a thermal interface and electrical insulator between electronic components and heat sinks. In the thickness range of 10 to 40 mil, BERGQUIST GAP PAD TGP A2000 is supplied with natural tack on both sides, allowing for excellent compliance to the adjacent surfaces of components. The 40 mil material thickness is supplied with lower tack on one side, allowing for burn-in processes and easy rework.
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Technické informace
| Barva | Šedá |
| Hodnocení hořlavosti | V-0 |
| Provozní teplota | -60.0 - 200.0 °C |
| Standardní tloušťka | 0.254 - 1.016 mm |
| Tepelná vodivost | 0.2 W/mK |
| Typ přepravce | Skleněná vlákna |
| Youngův modul, ASTM D575 | 379.0 KPa (55.0 psi ) |
BERGQUIST® GAP PAD® TGP A2000
BERGQUIST GAP PAD TGP A2000, High Performance, Thermally Conductive Gap Filling Material