Encapsulants

Protecting circuit boards can involve various materials placed on or around circuit boards and components to provide protection against particles, heat, moisture, and other external pressures. Henkel is a trusted supplier of encapsulant materials that are used in electronics manufacturing worldwide. From chip on board encapsulants such as glob top material to conformal coatings, underfills, low pressure molding, and potting solutions, Henkel offers a full range of circuit board protection materials that effectively protect circuit boards while help reduce costs. 

Our PCB encapsulation solutions include epoxy, silicone, urethane, and acrylic chemistries that provide manufacturing flexibility across applications. Learn more about the characteristics and benefits of our ECCOBOND^® encapsulation materials range here:

• Better reliability and mechanical performance, strong adhesion to various substrates, good TC/drop test performance
• Easy and tunable processing across a comprehensive range of applications
  • Excellent jet dispensing performance
  • Precise rheology control to meet specified flow requirement
  • Precise thixotropic for dot shape control
  • UV detectable
• Fast cure and dual curing mechanism for ultimate versatility
  • Heat cure, UV cure, and UV+ Moisture cure materials
• Moisture & heat resistance and stable electrical performance
  • High SIR after 85C/85RH conditioning (1wk)
  • High bias voltage
  • Suitable for harsh environments
  • Survive lead-free reflow
• Environmental compliance including halogen-free materials

Contact a member of our team today to find out more about all our encapsulation solutions

Henkel’s Encapsulant Materials Product Portfolio

Henkel’s Encapsulation materials span a wide range of needs and provide flexibility for specific needs relating to application and product chemistry. Find out more about our PCB protection solutions:

Encapsulant Chemistries

Industrial Applications

Our encapsulation solutions for electronic components have long been trusted materials for manufacturers across the globe. Our product solutions include flip chip materials such as semiconductor encapsulants, capillary underfills, die attach adhesives, and non conductive pastes. When it comes to electronic device manufacturing, Henkel has the material solutions that enable innovative electronic products.

Further Resources

For more information about our encapsulation solutions, download the following PDFs.