LOCTITE® ABLESTIK 2030SC
다른 명칭: ABLEBOND 2030SC (45G)
특징 및 이점
This flexible, hybrid-based die attach adhesive is designed for fast curing, high throughput component assemblies, and is suitable for a variety of package sizes.
For high throughput die attach applications with dissimilar surfaces – and a superior performance compared to soldering – choose LOCTITE® ABLESTIK 2030SC. This hybrid technology adhesive is specially formulated to reduce stress and warpage, and is snap curable – 1.5 minutes at 110°C (230°F) – supporting fast handling.
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기술 정보
| RT 다이 전단 강도, 2 x 2 mm Si die on Pd | 1.9 kg-f |
| 경화 방식 | 열경화 |
| 요변성 지수 | 4.6 |
| 인장 탄성률, @ 250.0 °C | 450.0 N/mm² (65000.0 psi ) |
| 적용 분야 | 다이 접착 |
| 추출 가능 이온 함량, 나트륨 이온(Na+) | 29.0 ppm |
| 추출 가능 이온 함량, 염소 이온(CI-) | 19.0 ppm |
| 추출 가능 이온 함량, 칼륨 이온(K+) | 4.0 ppm |
| 핫 다이 전단 강도 | 0.96 kg-f |
LOCTITE® ABLESTIK 2030SC
This flexible, hybrid-based die attach adhesive is designed for fast curing, high throughput component assemblies, and is suitable for a variety of package sizes.