LOCTITE® ABLESTIK 2030SC
Connu sous le nom de ABLEBOND 2030SC (45G)
Caractéristiques et avantages
This flexible, hybrid-based die attach adhesive is designed for fast curing, high throughput component assemblies, and is suitable for a variety of package sizes.
For high throughput die attach applications with dissimilar surfaces – and a superior performance compared to soldering – choose LOCTITE® ABLESTIK 2030SC. This hybrid technology adhesive is specially formulated to reduce stress and warpage, and is snap curable – 1.5 minutes at 110°C (230°F) – supporting fast handling.
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Informations techniques
| Applications | Soudage de puce |
| Indice thixotropique | 4.6 |
| Module d'élasticité, @ 250.0 °C | 450.0 N/mm² (65000.0 psi ) |
| Résistance au cisaillement puce RT, 2 x 2 mm Si die on Pd | 1.9 kg-f |
| Résistance au cisaillement puce chaude | 0.96 kg-f |
| Teneur ionique extractible, Chlorure (Cl) | 19.0 ppm |
| Teneur ionique extractible, Potassium (K+) | 4.0 ppm |
| Teneur ionique extractible, Sodium (Na+) | 29.0 ppm |
| Type de polymérisation | Polymérisation par la chaleur |
LOCTITE® ABLESTIK 2030SC
This flexible, hybrid-based die attach adhesive is designed for fast curing, high throughput component assemblies, and is suitable for a variety of package sizes.