LOCTITE® ABLESTIK 2030SC
Conocido como ABLEBOND 2030SC (45G)
Características y Ventajas
This flexible, hybrid-based die attach adhesive is designed for fast curing, high throughput component assemblies, and is suitable for a variety of package sizes.
For high throughput die attach applications with dissimilar surfaces – and a superior performance compared to soldering – choose LOCTITE® ABLESTIK 2030SC. This hybrid technology adhesive is specially formulated to reduce stress and warpage, and is snap curable – 1.5 minutes at 110°C (230°F) – supporting fast handling.
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Información técnica
| Aplicaciones | Unión |
| Contenido iónico extraíble, Cloruro (CI-) | 19.0 ppm |
| Contenido iónico extraíble, Potasio (K+) | 4.0 ppm |
| Contenido iónico extraíble, Sodio (Na+) | 29.0 ppm |
| Módulo de tracción, @ 250.0 °C | 450.0 N/mm² (65000.0 psi ) |
| Resistencia al corte a temperatura ambiente, 2 x 2 mm Si die on Pd | 1.9 kg-f |
| Resistencia al corte con calor | 0.96 kg-f |
| Tipo de curado | Curado Térmico |
| Índice tixotrópico | 4.6 |
LOCTITE® ABLESTIK 2030SC
This flexible, hybrid-based die attach adhesive is designed for fast curing, high throughput component assemblies, and is suitable for a variety of package sizes.