LOCTITE® ABLESTIK 2030SC
Known as ABLEBOND 2030SC (45G)
Features and Benefits
This flexible, hybrid-based die attach adhesive is designed for fast curing, high throughput component assemblies, and is suitable for a variety of package sizes.
For high throughput die attach applications with dissimilar surfaces – and a superior performance compared to soldering – choose LOCTITE® ABLESTIK 2030SC. This hybrid technology adhesive is specially formulated to reduce stress and warpage, and is snap curable – 1.5 minutes at 110°C (230°F) – supporting fast handling.
- Snap curable for quick handling
- Low stress bonding
- 1-part: no mixing required
- Suitable for variety of package sizes
Documents and Downloads
Looking for a TDS or SDS in another language?
Technical Information
| Applications | Die attach |
| Cure type | Heat cure |
| Extractable ionic content, Chloride (CI-) | 19.0 ppm |
| Extractable ionic content, Potassium (K+) | 4.0 ppm |
| Extractable ionic content, Sodium (Na+) | 29.0 ppm |
| Hot die shear strength | 0.96 kg-f |
| RT die shear strength, 2 x 2 mm Si die on Pd | 1.9 kg-f |
| Tensile modulus, @ 250.0 °C | 450.0 N/mm² (65000.0 psi ) |
| Thixotropic index | 4.6 |
LOCTITE® ABLESTIK 2030SC
This flexible, hybrid-based die attach adhesive is designed for fast curing, high throughput component assemblies, and is suitable for a variety of package sizes.