LOCTITE® ABLESTIK DX20C

Known as ECCOBOND DX-20C 0.03KG

Features and Benefits

LOCTITE ABLESTIK DX20C dielectric adhesive offers excellent adhesion strength, especially at wire bonding process temperature to minimize defect rate at assembly. It features strong heat / UV resistance and can be applied by pin transfer, stamping and dispensing.
LOCTITE® ABLESTIK DX20C dielectric adhesive offers excellent adhesion strength, especially at wire bonding process temperature to minimize defect rate at assembly. It features strong heat / UV resistance and can be applied by pin transfer, stamping and dispensing.
  • One component
  • No yellowing
  • Excellent adhesion
  • Long work life
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Technical Information

Applications Die attach
Cure type Heat cure
Hot die shear strength 5.0 kg-f
Key characteristics Conductivity: electrically non-conductive
RT die shear strength 12.8 kg-f
Thixotropic index 4.2
Viscosity, cone & plate, @ 25.0 °C Speed 10 rpm 12000.0 mPa·s (cP)