LOCTITE® ABLESTIK DX20C
Známé jako ECCOBOND DX-20C 0.03KG
Vlastnosti a výhody
LOCTITE ABLESTIK DX20C dielectric adhesive offers excellent adhesion strength, especially at wire bonding process temperature to minimize defect rate at assembly. It features strong heat / UV resistance and can be applied by pin transfer, stamping and dispensing.
LOCTITE® ABLESTIK DX20C dielectric adhesive offers excellent adhesion strength, especially at wire bonding process temperature to minimize defect rate at assembly. It features strong heat / UV resistance and can be applied by pin transfer, stamping and dispensing.
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Technické informace
| Aplikace | Připevnění formy |
| Klíčové vlastnosti | Vodivost: elektricky nevodivé |
| Pevnost ve střihu RT | 12.8 kg-f |
| Pevnost ve střihu za tepla | 5.0 kg-f |
| Tixotropní index | 4.2 |
| Viskozita, kužel & deska, @ 25.0 °C Speed 10 rpm | 12000.0 mPa.s (cP) |
| Způsob vytvrzování | Vytvrzování teplem |
LOCTITE® ABLESTIK DX20C
LOCTITE ABLESTIK DX20C dielectric adhesive offers excellent adhesion strength, especially at wire bonding process temperature to minimize defect rate at assembly. It features strong heat / UV resistance and can be applied by pin transfer, stamping and dispensing.