LOCTITE® ABLESTIK DX20C
被稱為 ECCOBOND DX-20C 0.03KG
功能與優點
LOCTITE ABLESTIK DX20C dielectric adhesive offers excellent adhesion strength, especially at wire bonding process temperature to minimize defect rate at assembly. It features strong heat / UV resistance and can be applied by pin transfer, stamping and dispensing.
LOCTITE® ABLESTIK DX20C dielectric adhesive offers excellent adhesion strength, especially at wire bonding process temperature to minimize defect rate at assembly. It features strong heat / UV resistance and can be applied by pin transfer, stamping and dispensing.
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技術資訊
| RT 模剪切強度 | 12.8 kg-f |
| 固化類型 | 熱固化 |
| 應用 | 晶片焊接 |
| 熱模剪切強度 | 5.0 kg-f |
| 粘度，錐型和板型, @ 25.0 °C Speed 10 rpm | 12000.0 mPa.s (cP) |
| 觸變指數 | 4.2 |
| 關鍵特性 | 導電性：不導電 |
LOCTITE® ABLESTIK DX20C
LOCTITE ABLESTIK DX20C dielectric adhesive offers excellent adhesion strength, especially at wire bonding process temperature to minimize defect rate at assembly. It features strong heat / UV resistance and can be applied by pin transfer, stamping and dispensing.