LOCTITE® ABLESTIK DX20C
Connu sous le nom de ECCOBOND DX-20C 0.03KG
Caractéristiques et avantages
LOCTITE ABLESTIK DX20C dielectric adhesive offers excellent adhesion strength, especially at wire bonding process temperature to minimize defect rate at assembly. It features strong heat / UV resistance and can be applied by pin transfer, stamping and dispensing.
LOCTITE® ABLESTIK DX20C dielectric adhesive offers excellent adhesion strength, especially at wire bonding process temperature to minimize defect rate at assembly. It features strong heat / UV resistance and can be applied by pin transfer, stamping and dispensing.
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Informations techniques
| Applications | Soudage de puce |
| Caractéristiques clés | Conductivité Non conducteur électrique |
| Indice thixotropique | 4.2 |
| Résistance au cisaillement puce RT | 12.8 kg-f |
| Résistance au cisaillement puce chaude | 5.0 kg-f |
| Type de polymérisation | Polymérisation par la chaleur |
| Viscosité, Cône & Plan, @ 25.0 °C Speed 10 rpm | 12000.0 mPa.s (cP) |
LOCTITE® ABLESTIK DX20C
LOCTITE ABLESTIK DX20C dielectric adhesive offers excellent adhesion strength, especially at wire bonding process temperature to minimize defect rate at assembly. It features strong heat / UV resistance and can be applied by pin transfer, stamping and dispensing.