LOCTITE® ABLESTIK DX20C
Bekend als ECCOBOND DX-20C 0.03KG
Kenmerken en voordelen
LOCTITE ABLESTIK DX20C dielectric adhesive offers excellent adhesion strength, especially at wire bonding process temperature to minimize defect rate at assembly. It features strong heat / UV resistance and can be applied by pin transfer, stamping and dispensing.
LOCTITE® ABLESTIK DX20C dielectric adhesive offers excellent adhesion strength, especially at wire bonding process temperature to minimize defect rate at assembly. It features strong heat / UV resistance and can be applied by pin transfer, stamping and dispensing.
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Technische informatie
| Afschuifsterkte RT-matrijs | 12.8 kg-f |
| Afschuifsterkte bij hete matrijs | 5.0 kg-f |
| Belangrijkste eigenschappen | Geleidbaarheid: Elektrisch niet geleidend |
| Thixotrope index | 4.2 |
| Toepassingen | Matrijsmontage |
| Uithardingstype | Uitharding door warmte |
| Viscositeit, kegel & plaat, @ 25.0 °C Speed 10 rpm | 12000.0 mPa.s (cP) |
LOCTITE® ABLESTIK DX20C
LOCTITE ABLESTIK DX20C dielectric adhesive offers excellent adhesion strength, especially at wire bonding process temperature to minimize defect rate at assembly. It features strong heat / UV resistance and can be applied by pin transfer, stamping and dispensing.