BERGQUIST® SIL PAD® TSP 1600
Conosciuto come Sil-Pad® 800
Caratteristiche e vantaggi
Thermally conductive, silicone insulator pad that features minimal thermal resistance and maximum thermal performance. Low mounting stress.
BERGQUIST® SIL PAD TSP 1600 is an electrically insulating material designed for applications that require high thermal performance and low mounting pressures. The fiberglass reinforced material with smooth surface texture is electrically isolating and is ideal for applications that require low mounting pressures. For information on UL certifications for our Thermal Management Materials Portfolio, please reference to UL file No. E59150.
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Informazioni tecniche
| Classe di infiammabilità | V-0 |
| Conducibilità termica | 1.6 W/mK |
| Costante dielettrica, @ 1kHz | 6.0 |
| Durezza shore, ASTM D2240 Shore A | 91.0 |
| Impedenza termica, ASTM D5470 @ 50 psi | 0.45 °C-in²/W |
| Resistività di volume | 1×10 Ohm m |
| Spessore film carrier | 0.025 mm |
| Spessore standard | 0.127 mm |
| Temperatura cambio di fase | 55.0 °C |
| Temperatura di esercizio | -60.0 - 180.0 °C |
| Tensione rottura dielettrica | 3000.0 Vac |
BERGQUIST® SIL PAD® TSP 1600
Thermally conductive, silicone insulator pad that features minimal thermal resistance and maximum thermal performance. Low mounting stress.