BERGQUIST® SIL PAD TSP 1600
Known as Sil-Pad® 800
Features and Benefits
Thermally conductive, silicone insulator pad that features minimal thermal resistance and maximum thermal performance. Low mounting stress.
BERGQUIST® SIL PAD TSP 1600 is an electrically insulating material designed for applications that require high thermal performance and low mounting pressures. The fiberglass reinforced material with smooth surface texture is electrically isolating and is ideal for applications that require low mounting pressures. For information on UL certifications for our Thermal Management Materials Portfolio, please reference to UL file No. E59150.
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Technical Information
| Carrier film thickness | 0.025 mm |
| Dielectric breakdown voltage | 3000.0 Vac |
| Dielectric constant, @ 1kHz | 6.0 |
| Flame rating | V-0 |
| Operating temperature | -60.0 - 180.0 °C |
| Phase change temperature | 55.0 °C |
| Shore hardness, ASTM D2240 Shore A | 91.0 |
| Standard thickness | 0.127 mm |
| Thermal conductivity | 1.6 W/mK |
| Thermal impedance, ASTM D5470 @ 50 psi | 0.45 °C-in²/W |
| Volume resistivity | 1×10 Ohm m |
BERGQUIST® SIL PAD TSP 1600
Thermally conductive, silicone insulator pad that features minimal thermal resistance and maximum thermal performance. Low mounting stress.