BERGQUIST® SIL PAD® TSP 1600
Bekannt als Sil-Pad® 800
Merkmale und Vorteile
Thermally conductive, silicone insulator pad that features minimal thermal resistance and maximum thermal performance. Low mounting stress.
BERGQUIST® SIL PAD TSP 1600 is an electrically insulating material designed for applications that require high thermal performance and low mounting pressures. The fiberglass reinforced material with smooth surface texture is electrically isolating and is ideal for applications that require low mounting pressures. For information on UL certifications for our Thermal Management Materials Portfolio, please reference to UL file No. E59150.
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Technische Informationen
| Betriebstemperatur | -60.0 - 180.0 °C |
| Dielektrische Durchbruchspannung | 3000.0 Vac |
| Dielektrizitätskonstante, @ 1kHz | 6.0 |
| Entflammbarkeit | V-0 |
| Phasenumwandlungstemperatur | 55.0 °C |
| Shore-Härte, ASTM D2240 Shore A | 91.0 |
| Standarddicke | 0.127 mm |
| Thermische Impedanz, ASTM D5470 @ 50 psi | 0.45 °C-in²/W |
| Trägerfilmdicke | 0.025 mm |
| Volumenwiderstand | 1×10 Ohm m |
| Wärmeleitfähigkeit | 1.6 W/mK |
BERGQUIST® SIL PAD® TSP 1600
Thermally conductive, silicone insulator pad that features minimal thermal resistance and maximum thermal performance. Low mounting stress.