LOCTITE ABLESTIK 8008HT
Terkenal sebagai ABLECOAT 8008HT
fitur dan keuntungan
LOCTITE ABLESTIK 8008HT, Proprietary Hybrid Chemistry, Die Attach
LOCTITE® ABLESTIK 8008HT adhesive is designed for high power devices in high UPH environment. It offers a lead-free alternative to soft solder and eutectic and can potentially reduce the layers of backside metallization required. This material can be applied to a wafer backside by stencil printing and then B-staged in an oven. The adhesive can then be cured after die attach in an in-line process exhibiting a consistent, void-free bondline without bleed. LOCTITE ABLESTIK 8008HT should be used with a pressure sensitive dicing tape and is not compatible with UV dicing tapes.
- Electrically conductive
- Thermally conductive
- Snap curable after B-stage
- Low modulus
Dokumen dan Unduhan
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Informasi Teknis
| Aplikasi | Pelekat Die |
| Indeks Tiksotropik | 4.0 |
| Jadwal Pengerasan, Snap Cure @ 170.0 °C | 20.0 sec. |
| Kekuatan Geser Die Panas, @ 260.0 °C 2 x 2 mm Si die on Cu LF | 2.6 kg-f |
| Kekuatan Geser Die RT, 2 x 2 mm Si die on Cu leadframe | 6.0 kg-f |
| Koefisien Muai Termal (CTE) | 37.0 ppm/°C |
| Koefisien Muai Termal (CTE), Above Tg | 62.0 ppm/°C |
| Konduktivitas Termal | 11.0 W/mK |
| Konten Ionik yang Dapat Diekstrak, Kalium (K+) | 9.0 ppm |
| Konten Ionik yang Dapat Diekstrak, Klorida (Cl-) | 9.0 ppm |
| Konten Ionik yang Dapat Diekstrak, Natrium (Na+) | 9.0 ppm |
| Modulus Tensil, @ 250.0 °C | 2451.0 N/mm² (355340.0 psi ) |
| Resistivitas Volume | 0.00005 Ohm cm |
| Suhu Transisi Kaca (Tg) | 264.0 °C |
| Tipe Pengeringan | Heat Cure |
| Viskositas, Brookfield CP51, @ 25.0 °C Speed 5 rpm | 50000.0 mPa.s (cP) |
| Warna | Abu-Abu: Perak |
LOCTITE ABLESTIK 8008HT
LOCTITE ABLESTIK 8008HT, Proprietary Hybrid Chemistry, Die Attach