BERGQUIST GAP PAD TGP 1500
Known as Gap Pad® 1500
Features and Benefits
Thermally conductive, silicone-based gap pad filler with a thermal conductivity rating of 1.5W/mK.
BERGQUIST® GAP PAD TGP 1500 is a silicone based, thermally conductive gap pad. Its unreinforced construction allows additional compliancy. This product has low hardness is conformable and is electrically isolating. The low modulus characteristic of the product offers optimal thermal performance with the ease of handling. For information on UL certifications for our Thermal Management Materials Portfolio, please reference to UL file No. E59150.
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Technical Information
| Color | Black |
| Operating temperature | -60.0 - 200.0 °C |
| Standard thickness | 0.508 - 5.08 mm |
| Thermal conductivity | 1.5 W/mK |
| Young's modulus, ASTM D575 | 310.0 KPa (45.0 psi ) |
BERGQUIST GAP PAD TGP 1500
Thermally conductive, silicone-based gap pad filler with a thermal conductivity rating of 1.5W/mK.