BERGQUIST® GAP PAD® TGP 1500
Known as Gap Pad® 1500
Features and Benefits
Thermally conductive, silicone-based gap pad filler with a thermal conductivity rating of 1.5W/mK.
BERGQUIST® GAP PAD TGP 1500 is a silicone based, thermally conductive gap pad. Its unreinforced construction allows additional compliancy. This product has low hardness, and is conformable and electrically isolating. The low modulus characteristic of the product offers optimal thermal performance with ease of handling.
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Technical Information
Colour | Black |
Operating temperature | -60.0 - 200.0 °C |
Standard thickness | 0.508 - 5.08 mm |
Thermal conductivity | 1.5 W/mK |
Young's modulus, ASTM D575 | 310.0 KPa (45.0 psi ) |