BERGQUIST® GAP PAD® TGP 1500
Bekannt als Gap Pad® 1500
Merkmale und Vorteile
Thermally conductive, silicone-based GAP PAD filler with a thermal conductivity rating of 1.5W/mK.
BERGQUIST® GAP PAD® TGP 1500 is a silicone based, thermally conductive gap pad. Its unreinforced construction allows additional compliancy. This product has low hardness, and is conformable and electrically isolating. The low modulus characteristic of the product offers optimal thermal performance with ease of handling.
Weiterlesen
Dokumente und Downloads
Suchen Sie nach einem TDS oder SDS in einer anderen Sprache?
Zusätzliche Dokumente
Technische Informationen
| Betriebstemperatur | -60.0 - 200.0 °C |
| Elastizitätsmodul, ASTM D575 | 310.0 KPa (45.0 psi ) |
| Farbe | Schwarz |
| Standarddicke | 0.508 - 5.08 mm |
| Wärmeleitfähigkeit | 1.5 W/mK |
BERGQUIST® GAP PAD® TGP 1500
Thermally conductive, silicone-based GAP PAD filler with a thermal conductivity rating of 1.5W/mK.