BERGQUIST® SIL PAD® TSP 1600S

BERGQUIST® SIL PAD TSP 1600 is specifically formulated to provide excellent thermal performance for discrete semiconductor applications that use low clamping pressures (e.g., spring clips at 10 to 50 psi.). In contrast, if you are designing for higher clamping pressure applications using discrete semi-conductors (e.g., 50 to 100 psi.), it is likely that you will prefer the combination of high thermal performance and cut-through resistance inherent in BERGQUIST® SIL PAD TSP 1600S material.

Each application has specific characteristics (e.g., surface finish, flatness tolerances, high pressure requirements, potential burrs, etc.) that determine which SIL PAD product will optimize thermal performance. Select a minimum of two pads that best fit the application, then conduct testing to determine which material performs the best.

BERGQUIST® SIL PAD TSP 1680 is specifically formulated to provide exceptional cut-through and crush resistance in combination with excellent heat transfer and dielectric properties. BERGQUIST® SIL PAD TSP 1680 has a proven history of reliability in high-pressure applications where surface imperfections such as burrs and dents are inherently common. These applications often include heavily machined metal surfaces manufactured from extrusions or castings. BERGQUIST® SIL PAD TSP 1600S carries a high level of crush resistance and is more likely to be used in burr-free or controlled-surface finish applications

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