LOCTITE® ABLESTIK ABP 2032S
Known as ABP 2032S (17G)
Features and Benefits
LOCTITE ABLESTIK ABP 2032S, Epoxy, Die Attach, Electrically Conductive Adhesive
LOCTITE® ABLESTIK ABP 2032S electrically conductive adhesive is designed as a Pb-free alternative to solder. It cures quickly at low temperatures for good stress control in large die size package applications.
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Technical Information
| Applications | Die attach |
| Coefficient of thermal expansion (CTE) | 54.0 ppm/°C |
| Cure type | Heat cure |
| Extractable ionic content, Chloride (CI-) | 29.0 ppm |
| Extractable ionic content, Potassium (K+) | 19.0 ppm |
| Extractable ionic content, Sodium (Na+) | 19.0 ppm |
| RT die shear strength | 16.0 kg-f |
| Recommended for use with | LeadFrame: gold |
| Tensile modulus, DMA @ 250.0 °C | 150.0 N/mm² (21755.0 psi ) |
LOCTITE® ABLESTIK ABP 2032S
LOCTITE ABLESTIK ABP 2032S, Epoxy, Die Attach, Electrically Conductive Adhesive