LOCTITE® ABLESTIK ABP 2032S
被稱為 ABP 2032S (17G)
功能與優點
LOCTITE ABLESTIK ABP 2032S, Epoxy, Die Attach, Electrically Conductive Adhesive
LOCTITE® ABLESTIK ABP 2032S electrically conductive adhesive is designed as a Pb-free alternative to solder. It cures quickly at low temperatures for good stress control in large die size package applications.
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技術資訊
| RT 模剪切強度 | 16.0 kg-f |
| 可萃取出的離子含量, 氯化物(CI-) | 29.0 ppm |
| 可萃取出的離子含量, 鈉(Na+) | 19.0 ppm |
| 可萃取出的離子含量, 鉀(K+) | 19.0 ppm |
| 固化類型 | 熱固化 |
| 建議推廣應用 | 導線架：金 |
| 應用 | 晶片焊接 |
| 拉伸模量, DMA @ 250.0 °C | 150.0 N/mm² (21755.0 psi ) |
| 熱膨脹係數 (CTE) | 54.0 ppm/°C |
LOCTITE® ABLESTIK ABP 2032S
LOCTITE ABLESTIK ABP 2032S, Epoxy, Die Attach, Electrically Conductive Adhesive