BERGQUIST® GAP PAD® TGP EMI1000
Known as Gap Pad® EMI 1.0
Features and Benefits
This thermally conductive, silicone-based, fiberglass reinforced, highly conformable GAP PAD filler provides EMI attenuation at frequencies of 1GHz and higher.
BERGQUIST® GAP PAD® TGP EMI1000 is a highly conformable, fiberglass reinforced, combination gap filling material. It offers both thermal conductivity performance and electromagnetic energy absorption (cavity resonances and/or cross-talk causing electromagnetic interference) at frequencies of 1GHz and higher. You can expect EMI attenuation and 1.0 W/m-K thermal conductivity performance with low assembly stress, and the soft nature of the material enhances wet-out at the interface, resulting in better thermal performance than harder materials with a similar performance rating. It has an inherent, natural tack on one side of the material for improved handling and no more thermally-impeding adhesive layers. The other side is tack-free, enhancing handling and rework when you need it. It’s supplied with a protective liner on the material’s tacky side.
Read More
Documents and Downloads
Looking for a TDS or SDS in another language?
Additional Documents
Technical Information
| Color | Black |
| Density | 2.4 g/cm³ |
| Dielectric breakdown voltage | 1700.0 Vac |
| Dielectric constant, @ 1kHz | 6.0 |
| Flame rating | V-0 |
| Heat capacity, ASTM E1269 | 1.3 J/g-K |
| Operating temperature | -60.0 - 200.0 °C |
| Shore hardness, Thirty second delay value, ASTM D2240 Bulk Rubber Shore 00 | 5.0 |
| Standard thickness | 0.508 - 3.175 mm |
| Thermal conductivity | 1.0 W/mK |
| Volume resistivity | 1×10 Ohm m |
BERGQUIST® GAP PAD® TGP EMI1000
This thermally conductive, silicone-based, fiberglass reinforced, highly conformable GAP PAD filler provides EMI attenuation at frequencies of 1GHz and higher.