BERGQUIST® GAP PAD® TGP 1500

Známé jako Gap Pad® 1500

Vlastnosti a výhody

Thermally conductive, silicone-based GAP PAD filler with a thermal conductivity rating of 1.5W/mK.
BERGQUIST® GAP PAD® TGP 1500 is a silicone based, thermally conductive gap pad. Its unreinforced construction allows additional compliancy. This product has low hardness, and is conformable and electrically isolating. The low modulus characteristic of the product offers optimal thermal performance with ease of handling.
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Technické informace

Barva Černá
Provozní teplota -60.0 - 200.0 °C
Standardní tloušťka 0.508 - 5.08 mm
Tepelná vodivost 1.5 W/mK
Youngův modul, ASTM D575 310.0 KPa (45.0 psi )