LOCTITE® ABLESTIK QMI529HT-LV
功能与优点
This BMI Hybrid-based, silver gray, conductive die-attach adhesive is designed for high-throughput applications.
LOCTITE® ABLESTIK QMI529HT-LV is a silver, thermally and electrically conductive die-attach adhesive for use in high-throughput applications. It offers good dispensing characteristics, low moisture absorption and low stress. It’s formulated with a BMI hybrid-based resin, is thermally stable at 260°C (500°F) reflow and cures when exposed to heat.
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技术信息
| RT 模剪切强度 | 20.0 kg-f |
| 可萃取出的离子含量, 氟化物 (F-) | 9.0 ppm |
| 可萃取出的离子含量, 氯化物 (CI-) | 9.0 ppm |
| 可萃取出的离子含量, 钠 (Na+) | 9.0 ppm |
| 可萃取出的离子含量, 钾 (K+) | 9.0 ppm |
| 固化方式 | 热+紫外线 |
| 应用 | 芯片焊接 |
| 拉伸模量, @ 250.0 °C | 738.0 N/mm² (107037.0 psi ) |
| 热模剪切强度 | 3.75 kg-f |
| 热膨胀系数 (CTE) | 62.0 ppm/°C |
LOCTITE® ABLESTIK QMI529HT-LV
This BMI Hybrid-based, silver gray, conductive die-attach adhesive is designed for high-throughput applications.