LOCTITE® ABLESTIK QMI529HT-LV
Features and Benefits
This BMI Hybrid-based, silver gray, conductive die-attach adhesive is designed for high-throughput applications.
LOCTITE® ABLESTIK QMI529HT-LV is a silver, thermally and electrically conductive die-attach adhesive for use in high-throughput applications. It offers good dispensing characteristics, low moisture absorption and low stress. It’s formulated with a BMI hybrid-based resin, is thermally stable at 260°C (500°F) reflow and cures when exposed to heat.
- Meets Mil Spec: MIL-STD-883 standards, Method 5011
- Meets NASA outgassing standards
- Hydrophobic
- Stable at high temperatures
- Low moisture absorption and low stress
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Technical Information
| Applications | Die attach |
| Coefficient of thermal expansion (CTE) | 62.0 ppm/°C |
| Cure type | Heat cure |
| Extractable ionic content, Chloride (CI-) | 9.0 ppm |
| Extractable ionic content, Fluoride (F-) | 9.0 ppm |
| Extractable ionic content, Potassium (K+) | 9.0 ppm |
| Extractable ionic content, Sodium (Na+) | 9.0 ppm |
| Hot die shear strength | 3.75 kg-f |
| RT die shear strength | 20.0 kg-f |
| Tensile modulus, @ 250.0 °C | 738.0 N/mm² (107037.0 psi ) |
LOCTITE® ABLESTIK QMI529HT-LV
This BMI Hybrid-based, silver gray, conductive die-attach adhesive is designed for high-throughput applications.