LOCTITE® ABLESTIK QMI529HT-LV
功能與優點
This BMI Hybrid-based, silver gray, conductive die-attach adhesive is designed for high-throughput applications.
LOCTITE® ABLESTIK QMI529HT-LV is a silver, thermally and electrically conductive die-attach adhesive for use in high-throughput applications. It offers good dispensing characteristics, low moisture absorption and low stress. It’s formulated with a BMI hybrid-based resin, is thermally stable at 260°C (500°F) reflow and cures when exposed to heat.
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技術資訊
| RT 模剪切強度 | 20.0 kg-f |
| 可萃取出的離子含量, 氟化物(F-) | 9.0 ppm |
| 可萃取出的離子含量, 氯化物(CI-) | 9.0 ppm |
| 可萃取出的離子含量, 鈉(Na+) | 9.0 ppm |
| 可萃取出的離子含量, 鉀(K+) | 9.0 ppm |
| 固化類型 | 熱固化 |
| 應用 | 晶片焊接 |
| 拉伸模量, @ 250.0 °C | 738.0 N/mm² (107037.0 psi ) |
| 熱模剪切強度 | 3.75 kg-f |
| 熱膨脹係數 (CTE) | 62.0 ppm/°C |
LOCTITE® ABLESTIK QMI529HT-LV
This BMI Hybrid-based, silver gray, conductive die-attach adhesive is designed for high-throughput applications.