LOCTITE® ABLESTIK 5662
Features and Benefits
LOCTITE ABLESTIK 5662, Epoxy Film, Assembly
LOCTITE® ABLESTIK 5662 epoxy adhesive is specially designed for applications where both flexibility and good adhesion are required. LOCTITE ABLESTIK 5662 adhesive is particularly useful in applications requiring good insulation between two substrates, such as bonding PC boards with solder bumps to heat sinks. This adhesive is also suitable for bonding materials with mismatched coefficients of thermal expansion.
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Technical Information
| Carrier film thickness | 2.0 mil |
| Carrier type | Kapton |
| Cure schedule, @ 90.0 °C | 3.0 hr. |
| Cure type | Heat cure |
| Glass transition temperature (Tg) | 100.0 °C |
| Physical form | Film |
| Shear strength, Aluminium | 2300.0 psi |
| Thermal conductivity | 0.2 W/mK |
LOCTITE® ABLESTIK 5662
LOCTITE ABLESTIK 5662, Epoxy Film, Assembly