LOCTITE® ABLESTIK 5662

Elementi i pogodnosti

LOCTITE ABLESTIK 5662, Epoxy Film, Assembly
LOCTITE® ABLESTIK 5662 epoxy adhesive is specially designed for applications where both flexibility and good adhesion are required. LOCTITE ABLESTIK 5662 adhesive is particularly useful in applications requiring good insulation between two substrates, such as bonding PC boards with solder bumps to heat sinks. This adhesive is also suitable for bonding materials with mismatched coefficients of thermal expansion.
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Dokumenti i preuzimanja

Tehnički podaci

Debljina nosećeg filma 2.0 mil
Fizički oblik Folija
Raspored polimerizacije, @ 90.0 °C 3.0 sat
Sila smicanja, Aluminijum 2300.0 psi
Temperatura razmekšavanja (Tg) 100.0 °C
Tip nosača Kapton
Tip očvršćavanja Očvršćavanje pomoću zagrevanja
Toplotna provodljivost 0.2 W/mK