LOCTITE® ABLESTIK 84-1LMINB1
功能與優點
LOCTITE ABLESTIK 84-1LMINB1, Epoxy, Die attach
LOCTITE® ABLESTIK 84-1LMINB1 die attach adhesive is formulated to bond difficult-to-wet surfaces such as palladium-silver capacitors terminations. This adhesive reduces capacitor shorting problems caused by resin bleed.
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技術資訊
| RT 模剪切強度, 2 x 2 mm on IC | 17.5 kg-f |
| 可萃取出的離子含量, 氯化物(CI-) | 20.0 ppm |
| 可萃取出的離子含量, 鈉(Na+) | 20.0 ppm |
| 可萃取出的離子含量, 鉀(K+) | 10.0 ppm |
| 吸濕性 | 1.1 % |
| 固化類型 | 熱固化 |
| 應用 | 晶片焊接 |
| 熱模剪切強度 | 3.4 kg-f |
| 熱膨脹係數 (CTE) | 50.0 ppm/°C |
LOCTITE® ABLESTIK 84-1LMINB1
LOCTITE ABLESTIK 84-1LMINB1, Epoxy, Die attach