LOCTITE® ABLESTIK 84-1LMINB1
Features and Benefits
LOCTITE ABLESTIK 84-1LMINB1, Epoxy, Die attach
LOCTITE® ABLESTIK 84-1LMINB1 die attach adhesive is formulated to bond difficult-to-wet surfaces such as palladium-silver capacitors terminations. This adhesive reduces capacitor shorting problems caused by resin bleed.
Read More
Documents and Downloads
Looking for a TDS or SDS in another language?
Technical Information
| Applications | Die attach |
| Coefficient of thermal expansion (CTE) | 50.0 ppm/°C |
| Cure type | Heat cure |
| Extractable ionic content, Chloride (CI-) | 20.0 ppm |
| Extractable ionic content, Potassium (K+) | 10.0 ppm |
| Extractable ionic content, Sodium (Na+) | 20.0 ppm |
| Hot die shear strength | 3.4 kg-f |
| Moisture absorption | 1.1 % |
| RT die shear strength, 2 x 2 mm on IC | 17.5 kg-f |
LOCTITE® ABLESTIK 84-1LMINB1
LOCTITE ABLESTIK 84-1LMINB1, Epoxy, Die attach