BERGQUIST® GAP PAD® TGP 6000ULM
Vlastnosti a výhody
A high performance, thermally conductive, silicone-based gap pad filler with a thermal conductivity rating of 6.0 W/m-K and ultra low modulus (ULM).
BERGQUIST® GAP PAD TGP 6000ULM is an extremely soft, thermal interface material with a higher natural tack, eliminating the need for additional adhesive layers and providing stick-in-place characteristics during assembly. The specially designed formulation offers excellent thermal performance at low pressures and is highly conforming, allowing for excellent wet-out at the interface.
Viac info
Dokumenty na prevzatie
Hľadáte TL alebo KBÚ v inom jazyku
Ďalšie dokumenty
Technické informácie
| Farba | Šedá |
| Prevádzková teplota | -60.0 - 200.0 °C |
| Typ nosiča | Sklenené vlákno |
| Štandardná hrúbka | 1.524 - 3.175 mm |
BERGQUIST® GAP PAD® TGP 6000ULM
A high performance, thermally conductive, silicone-based gap pad filler with a thermal conductivity rating of 6.0 W/m-K and ultra low modulus (ULM).