BERGQUIST GAP PAD TGP 6000ULM

Features and Benefits

A high performance, thermally conductive, silicone-based gap pad filler with a thermal conductivity rating of 6.0 W/m-K and ultra low modulus (ULM).
BERGQUIST® GAP PAD TGP 6000ULM is an extremely soft, thermal interface material with a higher natural tack, thereby eliminating the need for additional adhesive layers and provides stick-in-place characteristics during assembly. The specially designed formulation offers excellent thermal performance at low pressures and is highly conforming, allowing for excellent wet-out at the interface. For information on UL certifications for our Thermal Management Materials Portfolio, please reference to UL file No. E59150.
Read More

Technical Information

Carrier type Fiberglass
Color Gray
Operating temperature -60.0 - 200.0 °C
Standard thickness 1.524 - 3.175 mm