BERGQUIST® GAP FILLER TGF 1000SR
Poznano kot Gap Filler 1000SR
Lastnosti in prednosti
Two-part, silicone-based, thermally conductive, liquid gap-filling material with excellent slump resistance (stays in place). Ideal for use in automotive electronics applications.
BERGQUIST® GAP FILLER TGF 1000SR is a 2-part, silicone based, thermally-conductive liquid gap filling material that features superior slump resistance. The mixed system will cure at room temperature and can be accelerated with the addition of heat. Once cured, it provides a soft, thermally conductive, form-in place elastomer ideal for fragile assemblies, capable of filling unique and intricate air voids and gaps. It has excellent low and high temperature mechanical and chemical stability, and is intended for use in automotive electronics applications.
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Tehnične informacije
| Delovna temperatura | -60.0 - 175.0 °C |
| Način strjevanja | Strjevanje na podlagi toplote |
| Ocena plamena | V-0 |
| Toplotna prevodnost | 0.1 W/mK |
| Trdilec | |
| Barva, Trdilec | Bela |
BERGQUIST® GAP FILLER TGF 1000SR
Two-part, silicone-based, thermally conductive, liquid gap-filling material with excellent slump resistance (stays in place). Ideal for use in automotive electronics applications.