BERGQUIST® GAP FILLER TGF 1000SR
Znany jako Gap Filler 1000SR
Właściwości i korzyści
Two-part, silicone-based, thermally conductive, liquid gap-filling material with excellent slump resistance (stays in place). Ideal for use in automotive electronics applications.
BERGQUIST® GAP FILLER TGF 1000SR is a 2-part, silicone based, thermally-conductive liquid gap filling material that features superior slump resistance. The mixed system will cure at room temperature and can be accelerated with the addition of heat. Once cured, it provides a soft, thermally conductive, form-in place elastomer ideal for fragile assemblies, capable of filling unique and intricate air voids and gaps. It has excellent low and high temperature mechanical and chemical stability, and is intended for use in automotive electronics applications.
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Informacje techniczne
| Klasa palności | V-0 |
| Metoda utwardzania | Utwardzanie ciepłem |
| Przewodność cieplna | 0.1 W/mK |
| Temperatura robocza | -60.0 - 175.0 °C |
| Utwardzacz | |
| Kolor, Utwardzacz | Biały |
BERGQUIST® GAP FILLER TGF 1000SR
Two-part, silicone-based, thermally conductive, liquid gap-filling material with excellent slump resistance (stays in place). Ideal for use in automotive electronics applications.