BERGQUIST® GAP FILLER TGF 1000SR
Known as Gap Filler 1000SR
Features and Benefits
Two-part, silicone-based, thermally conductive, liquid gap-filling material with excellent slump resistance (stays in place). Ideal for use in automotive electronics applications.
BERGQUIST® GAP FILLER TGF 1000SR is a 2-part, silicone based, thermally-conductive liquid gap filling material that features superior slump resistance. The mixed system will cure at room temperature and can be accelerated with the addition of heat. Once cured, it provides a soft, thermally conductive, form-in place elastomer ideal for fragile assemblies, capable of filling unique and intricate air voids and gaps. It has excellent low and high temperature mechanical and chemical stability, and is intended for use in automotive electronics applications.
- Excellent slump resistance
- Excellent low and high temperature stability
- Ultra-conforming
- Excellent wet-out for low stress interface applications
- Thermal conductivity: 1.0 W/m-K
Documents and Downloads
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Additional Documents
Technical Information
| Cure type | Heat cure |
| Flame rating | V-0 |
| Operating temperature | -60.0 - 175.0 °C |
| Thermal conductivity | 0.1 W/mK |
| Hardener | |
| Color, Hardener | White |
BERGQUIST® GAP FILLER TGF 1000SR
Two-part, silicone-based, thermally conductive, liquid gap-filling material with excellent slump resistance (stays in place). Ideal for use in automotive electronics applications.