LOCTITE® ABLESTIK ABP 8163F-1
Features and Benefits
LOCTITE ABLESTIK ABP 8163F-1, Silicone, Die Attach, Non-conductive Adhesive
LOCTITE® ABLESTIK ABP 8163F-1 non-conductive die attach adhesive is designed for LED and sensor manufacturing applications
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Documents and Downloads
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Technical Information
| Applications | Die attach |
| Cure type | Heat cure |
| Thermal conductivity | 0.8 W/mK |
| Thixotropic index | 5.2 |
| Viscosity, Brookfield CP51, @ 25.0 °C Speed 5 rpm | 21000.0 mPa·s (cP) |
LOCTITE® ABLESTIK ABP 8163F-1
LOCTITE ABLESTIK ABP 8163F-1, Silicone, Die Attach, Non-conductive Adhesive