LOCTITE® ABLESTIK 3119
특징 및 이점
LOCTITE ABLESTIK 3119, Epoxy, Bonding
LOCTITE® ABLESTIK 3119 cures rapidly at relatively low temperature and provides excellent adhesion on a wide range of substrates. Typical applications include the assembly of electronics components which are heat sensitive. Please refer to the TDS for alternate cure schedules.
더 보기
기술 정보
| 경화 방식 | 열경화 |
| 유리전이온도(Tg) | 110.0 °C |
LOCTITE® ABLESTIK 3119
LOCTITE ABLESTIK 3119, Epoxy, Bonding