LOCTITE® ABLESTIK 3230
特長および利点
A silver electrically conductive adhesive for applications that require very fast cure at low temperatures.
LOCTITE® ABLESTIK 3230 is a silver electrically conductive die-attach epoxy for high-reliability package applications of various sizes. It cures fast when exposed to heat and offers good, low-stress adhesion to copper and high JEDEC performance.
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技術情報
| RTダイせん断強度, 2 x 2 mm, Si die Ag/Cu LF | 15.0 kg-f |
| アプリケーション(用途) | ダイ接着剤 |
| ガラス転移温度 (Tg) | 37.0 °C |
| チクソ性指数 | 5.6 |
| 体積抵抗率 | 0.05 Ohm cm |
| 熱膨張率 | 80.0 ppm/°C |
| 熱膨張率, Above Tg | 205.0 ppm/°C |
| 硬化スケジュール, 代替 ≤ 175.0 °C 40 min. ramp | 55.0 分 |
| 硬化スケジュール, 推奨 @ 175.0 °C 30 min. ramp | 45.0 分 |
| 硬化タイプ | 熱硬化 |
| 粘度、ブルックフィールド CP51, @ 25.0 °C Speed 5 rpm | 9500.0 mPa.s (cP) |
| 色 | シルバー（銀) |
LOCTITE® ABLESTIK 3230
A silver electrically conductive adhesive for applications that require very fast cure at low temperatures.