LOCTITE® ABLESTIK 3230
Features and Benefits
A silver electrically conductive adhesive for applications that require very fast cure at low temperatures.
LOCTITE® ABLESTIK 3230 is a silver electrically conductive die-attach epoxy for high-reliability package applications of various sizes. It cures fast when exposed to heat and offers good, low-stress adhesion to copper and high JEDEC performance.
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Technical Information
| Applications | Die attach |
| Coefficient of thermal expansion (CTE) | 80.0 ppm/°C |
| Coefficient of thermal expansion (CTE), Above Tg | 205.0 ppm/°C |
| Colour | Silver |
| Cure schedule, Alternate ≤ 175.0 °C 40 min. ramp | 55.0 min. |
| Cure schedule, Recommended @ 175.0 °C 30 min. ramp | 45.0 min. |
| Cure type | Heat cure |
| Glass transition temperature (Tg) | 37.0 °C |
| RT die shear strength, 2 x 2 mm, Si die Ag/Cu LF | 15.0 kg-f |
| Thixotropic index | 5.6 |
| Viscosity, Brookfield CP51, @ 25.0 °C Speed 5 rpm | 9500.0 mPa·s (cP) |
| Volume resistivity | 0.05 Ohm cm |
LOCTITE® ABLESTIK 3230
A silver electrically conductive adhesive for applications that require very fast cure at low temperatures.