LOCTITE® ECCOBOND EN 3838T
Features and Benefits
This 1-part, thixotropic coating liquid provides components on PCBs a flexible, low Tg encapsulation material.
LOCTITE® ECCOBOND EN 3838T is a black, thixotropic coating liquid for encapsulating components on PCBs. It's typically used for CSP and BGA package applications. It's formulated with an epoxy-based resin and cures fast at moderate temperatures. When cured, it provides physical protection, stable electronic performance, and temperature/humidity/bias testing protection.
- Low modulus
- Highly reworkable
- Fast curing
- Thixotropic for ease of application
Documents and Downloads
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Technical Information
| Coefficient of thermal expansion (CTE), Above Tg | 217.0 ppm/°C |
| Coefficient of thermal expansion (CTE), Below Tg | 57.0 ppm/°C |
| Cure schedule, @ 130.0 °C | 8.0 min. |
| Cure type | Heat cure |
| Glass transition temperature (Tg) | 2.0 °C |
| Viscosity, Brookfield CP51, @ 25.0 °C Speed 20 rpm | 6700.0 mPa·s (cP) |
LOCTITE® ECCOBOND EN 3838T
This 1-part, thixotropic coating liquid provides components on PCBs a flexible, low Tg encapsulation material.