LOCTITE® ECCOBOND EN 3838T

Features and Benefits

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LOCTITE ECCOBOND EN 3838T, Epoxy, Encapsulant
LOCTITE® ECCOBOND EN 3838T is designed to provide an flexible, low Tg material for encapsulating components on a PCB. When cured, this material provides physical protection and stable electronic performance and protection in temperature/humidity/bias testing.
  • Thixotropic
  • Fast cure at moderate temperatures
  • Low modulus
  • Low Tg
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Documents and Downloads

Technical Data Sheet
LOCTITE® ECCOBOND EN 3838T
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Technical Information

Coefficient of thermal expansion (CTE), Above Tg 217.0 ppm/°C
Coefficient of thermal expansion (CTE), Below Tg 57.0 ppm/°C
Cure schedule, @ 130.0 °C 8.0 min.
Cure type Heat cure
Glass transition temperature (Tg) 2.0 °C
Viscosity, Brookfield CP51, @ 25.0 °C Speed 20 rpm 6700.0 mPa·s (cP)