LOCTITE® ECCOBOND EN 3838T
Features and Benefits
LOCTITE ECCOBOND EN 3838T, Epoxy, Encapsulant
LOCTITE® ECCOBOND EN 3838T is designed to provide an flexible, low Tg material for encapsulating components on a PCB. When cured, this material provides physical protection and stable electronic performance and protection in temperature/humidity/bias testing.
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Technical Information
| Coefficient of thermal expansion (CTE), Above Tg | 217.0 ppm/°C |
| Coefficient of thermal expansion (CTE), Below Tg | 57.0 ppm/°C |
| Cure schedule, @ 130.0 °C | 8.0 min. |
| Cure type | Heat cure |
| Glass transition temperature (Tg) | 2.0 °C |
| Viscosity, Brookfield CP51, @ 25.0 °C Speed 20 rpm | 6700.0 mPa·s (cP) |
LOCTITE® ECCOBOND EN 3838T
LOCTITE ECCOBOND EN 3838T, Epoxy, Encapsulant