LOCTITE® 3627
Known as Chipbonder 3627
Features and Benefits
LOCTITE 3627, Epoxy, Surface mount adhesive
LOCTITE® 3627 is designed for the bonding of surface mounted devices to printed circuit boards prior to wave soldering. Particularly suited for applications where high dispense speeds, high dot profile, high wet strength and good electrical characteristics are required. The product is also suitable for stencil print applications. LOCTITE 3627 has been used successfully in lead free processes with water and alcohol based fluxes under conditions outlined in the Environmental Resistance section.
Read More
Documents and Downloads
Looking for a TDS or SDS in another language?
Technical Information
| Casson viscosity, cone & plate Haake PK100, M10/PK1, 2°, @ 25.0 °C | 2.0 - 5.0 Pa∙s |
| Cure type | Heat cure |
| Number of components | 1 part |
| Physical form | Gel |
| Shear strength, Steel (grit blasted) | 1957.0 psi |
| Storage temperature | 2.0 - 8.0 °C |
| Yield point, cone & plate, Haake PK100, M10/PK1, 2°, @ 25.0 °C | 100.0 - 275.0 Pa∙s |
LOCTITE® 3627
LOCTITE 3627, Epoxy, Surface mount adhesive