LOCTITE® 3627
Bekannt als Chipbonder 3627
Merkmale und Vorteile
LOCTITE 3627, Epoxy, Surface mount adhesive
LOCTITE® 3627 is designed for the bonding of surface mounted devices to printed circuit boards prior to wave soldering. Particularly suited for applications where high dispense speeds, high dot profile, high wet strength and good electrical characteristics are required. The product is also suitable for stencil print applications. LOCTITE 3627 has been used successfully in lead free processes with water and alcohol based fluxes under conditions outlined in the Environmental Resistance section.
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Technische Informationen
| Anzahl Komponenten | 1K |
| Aushärtetechnik | Aushärtung durch Wärme |
| Casson Viskosität, Kegel-Platte-System Haake PK100, M10/PK1, 2°, @ 25.0 °C | 2.0 - 5.0 Pa∙s |
| Fließgrenze, Cone & Plate, Haake PK100, M10/PK1, 2°, @ 25.0 °C | 100.0 - 275.0 Pa∙s |
| Lagertemperatur | 2.0 - 8.0 °C |
| Physikalische Form | Gel |
| Scherfestigkeit, Stahl (sandgestrahlt) | 1957.0 psi |
LOCTITE® 3627
LOCTITE 3627, Epoxy, Surface mount adhesive