LOCTITE® 3627
Tuntud kui Chipbonder 3627
Omadused ja eelised
LOCTITE 3627, Epoxy, Surface mount adhesive
LOCTITE® 3627 is designed for the bonding of surface mounted devices to printed circuit boards prior to wave soldering. Particularly suited for applications where high dispense speeds, high dot profile, high wet strength and good electrical characteristics are required. The product is also suitable for stencil print applications. LOCTITE 3627 has been used successfully in lead free processes with water and alcohol based fluxes under conditions outlined in the Environmental Resistance section.
Lugege rohkem
Dokumendid ja allalaadimised
Otsite TDS-i või SDS-i teises keeles?
Tehniline teave
| Füüsiline vorm | Geel |
| Kasseti viskoossus, koonus ja plaat Haake PK100, M10/PK1, 2°, @ 25.0 °C | 2.0 - 5.0 Pa∙s |
| Komponentide arv | 1-komponentne |
| Nihkejõud, Teras (abrasiivpulber) | 1957.0 psi |
| Säilitustemperatuur | 2.0 - 8.0 °C |
| Tahkumistüüp | Kuumkõvenemine |
| Voolavuspiir, koonus ja plaat, Haake PK100, M10/PK1, 2°, @ 25.0 °C | 100.0 - 275.0 Pa∙s |
LOCTITE® 3627
LOCTITE 3627, Epoxy, Surface mount adhesive