LOCTITE® ABLESTIK 566
Features and Benefits
LOCTITE ABLESTIK 566, Epoxy Film, Assembly
LOCTITE ABLESTIK 566 is designed for bonding materials with mismatched coefficients of thermal expansion. This material is the low temperature curing version of LOCTITE ABLESTIK 561 adhesive.
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Documents and Downloads
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Technical Information
| Carrier film thickness | 1.0 mil |
| Carrier type | Glass fabric |
| Cure schedule, @ 90.0 °C | 3.0 hr. |
| Cure type | Heat Cure |
| Glass transition temperature (Tg) | 45.0 °C |
| Physical form | Film |
| Shear strength, Aluminum | 1800.0 psi |
LOCTITE® ABLESTIK 566
LOCTITE ABLESTIK 566, Epoxy Film, Assembly