LOCTITE® ECCOBOND UV 9061F
Features and Benefits
LOCTITE ECCOBOND UV 9061F, Acrylate, Assembly
LOCTITE® ECCOBOND UV 9061F no flow, UV/moisture cure encapsulant is designed for local circuit board protection. This product is fluorescent when viewed with ultraviolet (black) light.
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Technical Information
| Coefficient of thermal expansion (CTE), Above Tg | 189.0 ppm/°C |
| Coefficient of thermal expansion (CTE), Below Tg | 78.0 ppm/°C |
| Cure schedule | 20.0 sec. |
| Cure schedule light intensity | 100.0 mW/cm² |
| Cure type | UV cure |
| Depth of cure | 0.2 |
| Glass transition temperature (Tg) | 56.0 °C |
LOCTITE® ECCOBOND UV 9061F
LOCTITE ECCOBOND UV 9061F, Acrylate, Assembly