LOCTITE® ECCOBOND UV 9061F

Features and Benefits

LOCTITE ECCOBOND UV 9061F, Acrylate, Assembly
LOCTITE® ECCOBOND UV 9061F no flow, UV/moisture cure encapsulant is designed for local circuit board protection. This product is fluorescent when viewed with ultraviolet (black) light.
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Technical Information

Coefficient of thermal expansion (CTE), Above Tg 189.0 ppm/°C
Coefficient of thermal expansion (CTE), Below Tg 78.0 ppm/°C
Cure schedule 20.0 sec.
Cure schedule light intensity 100.0 mW/cm²
Cure type UV cure
Depth of cure 0.2
Glass transition temperature (Tg) 56.0 °C