LOCTITE® ECCOBOND UV 9061F
功能与优点
LOCTITE ECCOBOND UV 9061F, Acrylate, Assembly
LOCTITE® ECCOBOND UV 9061F no flow, UV/moisture cure encapsulant is designed for local circuit board protection. This product is fluorescent when viewed with ultraviolet (black) light.
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技术信息
| 固化方式 | 紫外线固化 |
| 固化时间 | 20.0 秒 |
| 固化时间光强度 | 100.0 mW/cm² |
| 固化深度 | 0.2 |
| 热膨胀系数 (CTE), Above Tg | 189.0 ppm/°C |
| 热膨胀系数 (CTE), Below Tg | 78.0 ppm/°C |
| 玻璃化温度 (Tg) | 56.0 °C |
LOCTITE® ECCOBOND UV 9061F
LOCTITE ECCOBOND UV 9061F, Acrylate, Assembly