LOCTITE® ABLESTIK ABP 8066T
Características y Ventajas
LOCTITE ABLESTIK ABP 8066T, Hybrid chemistry, Die Attach, Highly filled, Conductive Adhesive
LOCTITE® ABLESTIK ABP 8066T highly filled, conductive die attach adhesive is designed to provide high thermal and electrical conductivity in the attachment of integrated circuits and components onto metallic leadframes. The material is hydrophobic and stable at high temperatures. It is formulated to provide high heat transfer generated by power devices. This material can also be used as a soft solder alternate for applications requiring high thermal and electrical conductivity.
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Información técnica
| Aplicaciones | Unión |
| Coeficiente de dilatación térmica (CDT) | 53.0 ppm/°C |
| Coeficiente de dilatación térmica (CDT), Above Tg | 90.0 ppm/°C |
| Conductividad térmica | 15.0 W/mK |
| Temperatura de transición vítrea (Tg) | 67.0 °C |
| Tipo de curado | Curado Térmico |
| Viscosidad, Brookfield CP51, @ 25.0 °C Speed 5 rpm | 10000.0 mPa.s (cP) |
| Índice tixotrópico | 6.0 |
LOCTITE® ABLESTIK ABP 8066T
LOCTITE ABLESTIK ABP 8066T, Hybrid chemistry, Die Attach, Highly filled, Conductive Adhesive